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SEMICONDUCTOR MANUFACTURING

Ultra-Pure Semiconductor
Sealing Solutions

Mission-critical sealing for plasma chambers, etching equipment, and CVD systems. Our FFKM solutions ensure zero contamination with ultra-pure materials validated by the world's leading semiconductor manufacturers.

<10
ppb Extractables
600°F
Max Temperature
Class 10
Cleanroom Compatible
99.9%
Plasma Resistance

Plasma Chamber Cross-Section

PLASMA
CF₄/CHF₃
Chamber Wall Seals
FFKM Critical
Gas Feed Lines
Ultra-Pure
Pump Port Seals
High Vacuum

Semiconductor Manufacturing Applications

From front-end processing to back-end packaging, our sealing solutions enable the precision and purity required for advanced semiconductor manufacturing.

Plasma Processing Equipment

Critical sealing for plasma etching chambers, RIE systems, and PECVD equipment where aggressive plasma environments demand ultimate material performance.

Etch Chambers Kalrez 6375
Ion Beam Systems Kalrez 7075
Plasma CVD Kalrez 4079
Key Requirements: CF₄/CHF₃/NF₃ resistance, low particle generation, thermal cycling stability

CVD & Deposition Systems

Ultra-pure sealing for chemical vapor deposition, atomic layer deposition, and sputtering systems requiring contamination-free processing.

ALD Chambers Ultra-Pure FFKM
MOCVD Systems High-Temp FFKM
Sputter Tools Low Outgassing
Key Requirements: Ultra-low extractables (<10 ppb), high-temperature stability, metal contamination control

Lithography & Metrology

Precision sealing for lithography steppers, immersion systems, and metrology equipment where dimensional stability is critical.

Immersion Systems DI Water Compatible
EUV Scanners Ultra-High Vacuum
Metrology Tools Dimensional Stability
Key Requirements: Chemical compatibility with photoresists and solvents, precision tolerances

Supported Equipment Types

Etching Equipment

• Reactive Ion Etchers (RIE)
• Deep RIE (DRIE) Systems
• Ion Beam Etchers
• Plasma Ashers
• Wet Etching Systems

Deposition Tools

• ALD Chambers
• PECVD Reactors
• MOCVD Systems
• Sputter Coaters
• E-beam Evaporators

Thermal Processing

• RTP Systems
• Diffusion Furnaces
• Oxidation Furnaces
• Annealing Systems
• LPCVD Furnaces

Analytical Equipment

• SEM Chambers
• XPS Systems
• Mass Spectrometers
• Ion Beam Tools
• Vacuum Chambers

Advanced Materials Technology

Our semiconductor-grade FFKM materials are engineered specifically for the demanding requirements of leading-edge chip manufacturing.

Semiconductor-Grade Material Properties

Validated by Fortune 500 semiconductor manufacturers

Property Test Method Kalrez 6375 Kalrez 7075 Kalrez 8575
Extractables (DI Water) SEMI F57 < 5 ppb < 3 ppb < 1 ppb
Particle Generation IEST-RP-CC001 Class 10 Class 1 Class 1
Plasma Resistance (CF₄) ASTM F1058 Excellent Superior Ultimate
Temperature Range Continuous Service -15°F to 600°F -40°F to 550°F -65°F to 500°F
Metal Content (Al, Na, K) ICP-MS < 10 ppb each < 5 ppb each < 1 ppb each

Plasma Gas Compatibility

Carbon Tetrafluoride (CF₄)
Primary etching gas
Excellent
Trifluoromethane (CHF₃)
Oxide etching
Excellent
Nitrogen Trifluoride (NF₃)
Chamber cleaning
Excellent
Sulfur Hexafluoride (SF₆)
Silicon etching
Very Good
Oxygen Plasma (O₂)
Resist stripping
Excellent

Contamination Control

Metal Contamination (ppb)

Aluminum (Al)
< 1 ppb
Sodium (Na)
< 1 ppb
Potassium (K)
< 1 ppb
Iron (Fe)
< 2 ppb

Particle Performance

Particle Size > 0.1 μm < 10/m³
Particle Size > 0.5 μm < 1/m³
Tested per IEST-RP-CC001

Semiconductor ROI Analysis

Quantify the business impact of superior sealing performance in your semiconductor manufacturing operations.

Cost Impact Calculator

$
Average etch chamber value
$
Including lost wafer production

Annual Cost Analysis

Current State (Standard FKM)

Seal Failures per Year: 20 events
Downtime Hours: 480 hours
Lost Production Cost: $7,200,000
Material Costs: $50,000
Total Annual Cost: $7,250,000

With FFKM Upgrade

Seal Failures per Year: 2 events
Downtime Hours: 48 hours
Lost Production Cost: $720,000
Material Costs: $150,000
Total Annual Cost: $870,000

Annual Savings

Total Savings: $6,380,000
ROI on Material Upgrade: 6,380%
Payback Period: 5.7 days

Get Your Semiconductor Sealing Quote

Our semiconductor specialists understand your critical requirements. Get a detailed technical proposal with material certifications and contamination analysis within 24 hours.

Technical Requirements

🔒 All technical information is confidential and protected

Your Quote Package Includes

Material Certification Package

Complete extractables analysis, contamination reports, and SEMI standard compliance documentation.

24-Hour Technical Response

Priority handling by our semiconductor specialists with detailed material recommendations.

ROI Cost Analysis

Detailed downtime cost analysis showing potential savings from seal reliability improvements.

Free Evaluation Samples

Qualified samples for testing in your equipment with full technical support.

Trusted by Industry Leaders

500+
Semiconductor Fabs
15+
Years Experience
Validated by Fortune 500 equipment manufacturers